NEWS & TOPICS

2026.06.15

PRODUCT SUPPORT

Notice of End of Support for Flexible Die Bonder DB830

2026.06.10

PRODUCT SUPPORT

Notice of End of Support for Flexible Die Bonder DB800HS/HSD【Updated】

2026.06.02

PRODUCT SUPPORT

Notice of Support Termination for DB800/DB830 series　Running on Windows XP

2026.06.02

PRODUCT SUPPORT

Notice of Support Termination for Die Bonder Running on Windows 7

2026.03.18

NEWS

FUJI Group’s Fasford Technology to Unveil Next-Generation Die Bonder “XERDIA” at SEMICON CHINA 2026 for the First Time in the World

2025.04.03

NEWS

Installation of DB850H at Disco’s Mid-Process Research Center

2025.03.18

NEWS

SEMICON China 2025

2020.04.23

NEWS

Notice regarding the effect of the COVID-19 coronavirus

2019.09.29

NEWS

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