We introduce the technology of Fasford Technology, which boasts the world's top share of the memory die bonder market.
- Technology 1
Low stress die picking up technology
- It handles the thin, brittle dies gently and carefully.
- The technology to pick up fixed dies without putting stress on them. The thickness of a die is between 25 and 50㎛ and it is as thin as a plastic bag. This is why it is very fragile and breaks easily with force like a plate of glass. Fasford Technology Co., Ltd.'s die bonder has a technology which can treat such thin and fragile die without stress by picking it up with vacuum adsorption in the same time than pushing it up from the bottom.
- Technology 2
High quality die stacking technology
- It is able to place dies precisely in the right position, without deviating an inch.
- The technology to place and stack the picked up dies in the exact position.
This is a very important technology as "Memory Capacity Increase" becomes possible by rising the die stacking amount.
A compact recording medium with a large memory capacity will be made by stacking many of the thinner dies and it realizes the miniaturization of the device which install the medium.