Founded as Ome Electronics Kogyousho Co., Ltd. under the group umbrella of the Semiconductor Division of Hitachi, Ltd.
Started manufacturing stems for germanium transistors
Gained recognition for opening a canteen for our staff and received a letter of appreciation for our cooperation in the promotion of welfare from the Governor of Tokyo
Changed company name to Hitachi Ome Electronics Kogyousho Co., Ltd.
Started manufacturing power IC
Inauguration of Precision Center as semiconductor device fabrication department
Started manufacturing a new power IC product (new SIL)
Changed company name to Hitachi Ome Denshi Co., Ltd.
Started semiconductor fabrication equipment development, manufacturing, and servicing operations
Started manufacturing high speed full automatic wire bonder (AUTAS)
Opened Hamura Plant (in Ome, Tokyo)
Changed company name to Hitachi Tokyo Electronics Co., Ltd.
Ultra sensitive gas analyzer (Atmospheric pressure ionization mass spectrometer) won a "10 great new products" award presented by the Nikkan Kogyo Shimbun (The Daily Industrial News) in 1985.
Started manufacturing Pellet Bonder PB Series
Yamanashi Plant starts operation
Started manufacturing high speed and high precision LOC mounter LM Series
Started manufacturing die boner DB Series for general-purpose products
Started manufacturing die bonder CM Series specially designed for DRAM
Acquired ISO9001 certification
Acquired ISO14001 certification
Takasaki Equipment Department integrated into Yamanashi Plant
Marketing of world’s first 300 mm compatible equipment (DB530) begins
Eastern Japan Semiconductor Technologies, inc. established
Note: Merger with Hitachi Tohbu Semiconductor, Ltd. and Sagami Plant of Hitachi Hokkai Semiconductor, Ltd.
Company name changed to Renesas Eastern Japan Semiconductor, inc.
Marketing Department integrated into Yamanashi Plant
Top market share for die bonders worldwide
Equipment Division of Renesas Eastern Japan Semiconductor, inc. integrated into Hitachi High-Tech Instruments Co., Ltd.
The Japanese government lauds research institutions and companies involved in the development of the Hayabusa spacecraft used for exploration of the asteroid Itokawa. Our equipment was integrated in the plant for analysis of the sample returned to earth and thereby contributed to the Hitachi Group receiving recognition.
Won a CS Award presented by VLSI
Bonding Equipment Division of Hitachi High-Tech Instruments Co., Ltd. split off to form Fasford Technology Co., Ltd.
Fasford Technology Co., Ltd. established as independent company
Started manufacturing high-speed high-performance automatic die bonder DD Series
Won the grand prize in the category "Manufacturing" of Yamanashi Industry Awards
Joined the corporate group of FUJI CORPORATION
The shipment quantity of the devices that support 300mm reached 4500