History

19635

Founded as Ome Electronics Kogyousho Co., Ltd. under the group umbrella of the Semiconductor Division of Hitachi, Ltd.

196310

Started manufacturing stems for germanium transistors

196511

Gained recognition for opening a canteen for our staff and received a letter of appreciation for our cooperation in the promotion of welfare from the Governor of Tokyo

19698

Changed company name to Hitachi Ome Electronics Kogyousho Co., Ltd.

197311

Started manufacturing power IC

19776

Inauguration of Precision Center as semiconductor device fabrication department

19778

Started manufacturing a new power IC product (new SIL)

19782

Changed company name to Hitachi Ome Denshi Co., Ltd.

19794

Started semiconductor fabrication equipment development, manufacturing, and servicing operations

197911

Started manufacturing high speed full automatic wire bonder (AUTAS)

19818

Opened Hamura Plant (in Ome, Tokyo)

19854

Changed company name to Hitachi Tokyo Electronics Co., Ltd.

198512

Ultra sensitive gas analyzer (Atmospheric pressure ionization mass spectrometer) won a "10 great new products" award presented by the Nikkan Kogyo Shimbun (The Daily Industrial News) in 1985.

19894

Started manufacturing Pellet Bonder PB Series

19915

Yamanashi Plant starts operation

19915

Started manufacturing high speed and high precision LOC mounter LM Series

19915

Started manufacturing die boner DB Series for general-purpose products

1992

Started manufacturing die bonder CM Series specially designed for DRAM

19969

Acquired ISO9001 certification

19987

Acquired ISO14001 certification

19992

Takasaki Equipment Department integrated into Yamanashi Plant

200012

Marketing of world’s first 300 mm compatible equipment (DB530) begins

20024

Eastern Japan Semiconductor Technologies, inc. established
Note: Merger with Hitachi Tohbu Semiconductor, Ltd. and Sagami Plant of Hitachi Hokkai Semiconductor, Ltd.

200310

Company name changed to Renesas Eastern Japan Semiconductor, inc.

20043

Marketing Department integrated into Yamanashi Plant

2005

Top market share for die bonders worldwide

20104

Equipment Division of Renesas Eastern Japan Semiconductor, inc. integrated into Hitachi High-Tech Instruments Co., Ltd.

201012

The Japanese government lauds research institutions and companies involved in the development of the Hayabusa spacecraft used for exploration of the asteroid Itokawa. Our equipment was integrated in the plant for analysis of the sample returned to earth and thereby contributed to the Hitachi Group receiving recognition.

2011

Won a CS Award presented by VLSI

20153

Bonding Equipment Division of Hitachi High-Tech Instruments Co., Ltd. split off to form Fasford Technology Co., Ltd.

20154

Fasford Technology Co., Ltd. established as independent company

201610

Started manufacturing high-speed high-performance automatic die bonder DD Series

201711

Won the grand prize in the category "Manufacturing" of Yamanashi Industry Awards

20188

Joined the corporate group of FUJI CORPORATION

20192

The shipment quantity of the devices that support 300mm reached 4500