Product information

DB Series

DB830plus+
DB830plusH
DB830plusH is a high accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process.

High quality / High productivity

Use of intermediate stage ensures high quality and high productivity

Multilayering support

  • • Improved accuracy of bonding placement
  • • Integrated vision system with position correction
  • • Clean operation support reduces particle contamination during multilayering

Thin die bonding technology

  • • Multi-stage pickup enables thin die pickup operation
  • • Wide variety of bonding sequences helps to reduce die stresses

Series

DB830plus+/DB830plus/DB830P

DB830plus+
DD100
DD100
DD100 utilizes the characteristics of DB Series and it's equipped with a newly developed dual pickup & bond head. Furthermore, it's also equipped with a newly developed dual lane, which enables categorization of wafers. It's a high productivity die bonder that supports various different types of production.

High quality / High productivity

Newly developed dual pickup bond head & dual lane design in combination with an intermediate stage realizes high quality and high productivity

Support for various production formats

  • • Newly developed dual lane enables wafer category sorting and provides support for production of different types of products

Thin die bonding technology

  • • Thin die pickup is made possible by multi-stage pushup method etc.
  • • Versatile bonding sequence control reduces die stresses

Series

DD100 / DD100F

DD100

CM Series

DB830plus+
CM700X
The CM700X supports assembly of advanced packages such as required for high-speed DRAM. A lamination function and integrated bulk recognition capability result in high performance and high accuracy positioning technology enables the realization of narrow pad pitch support.

Features

  • • Compatible with 300 mm and 200 mm wafers
  • • Supports assembly of μBGA®* and BOC DRAM packages
  • • Flexible mounting mode selection allows optimal matching to various packages
  • * µBGA® is a registered trademark of Tessera, Inc.

Series

CM700R / CM700X / CM700MX

DB830plus+