Product information

DB850 Series

DB850 Series
DB850 Series is a higher series of DB830plus+ with higher accuracy. This is a 2-in-1 concept die bonder which achieved high levels of both stacked die packaging with DAF process and compatibility with general-purpose products of paste process.
Its easy switching between direct mode and parallel mode enables flexible production with the optimal process.

High quality / High productivity

Use of intermediate stage ensures high quality and high productivity

Multilayering support

  • • Improved accuracy of bonding placement
  • • Integrated vision system with position correction
  • • Clean operation support reduces particle contamination during multilayering

Thin die bonding technology

  • • Multi-stage pickup enables thin die pickup operation
  • • Wide variety of bonding sequences helps to reduce die stresses

Series

DB850H

DB850 Series

DB830plus+ Series

DB830plus+ Series
DB830plus+ Series is a high accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process.

High quality / High productivity

Use of intermediate stage ensures high quality and high productivity

Multilayering support

  • • Improved accuracy of bonding placement
  • • Integrated vision system with position correction
  • • Clean operation support reduces particle contamination during multilayering

Thin die bonding technology

  • • Multi-stage pickup enables thin die pickup operation
  • • Wide variety of bonding sequences helps to reduce die stresses

Series

DB830plus+D/DB830plus+/DB830plusH/DB830plusS

DB830plus+ Series

DD100 Series

DD100 Series
DD100
DD100 utilizes the characteristics of DB Series and it's equipped with a newly developed dual pickup & bond head. Furthermore, it's also equipped with a newly developed dual lane, which enables categorization of wafers. It's a high productivity die bonder that supports various different types of production.

High quality / High productivity

Newly developed dual pickup bond head & dual lane design in combination with an intermediate stage realizes high quality and high productivity

Support for various production formats

  • • Newly developed dual lane enables wafer category sorting and provides support for production of different types of products

Thin die bonding technology

  • • Thin die pickup is made possible by multi-stage pushup method etc.
  • • Versatile bonding sequence control reduces die stresses

Series

DD100 / DD100F

DD100 Series