NEWS&TOPICS

Fasford Technology has lent and installed the die bonder DB850H at the Mid-Process Research Center operated by Disco Corporation (hereinafter referred to as Disco, located in Ota-ku, Tokyo) in Tahara, Mashiki-machi, Kamimashiki-gun, Kumamoto Prefecture. This collaboration aims to support the research and development of Disco’s wafer automatic transport system, RoofWay. (Lending period: January 29, 2025 – December 26, 2025)

At the center, research and development are being conducted to achieve a production process that minimizes operator involvement from wafer grinding to dicing processes, thereby reducing quality fluctuations caused by human involvement. By connecting the die bonder to RoofWay, we aim to further expand the system.

Related information: Disco Company | China Crafts Research Center opens