Product information
DB850 Series
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DB850 Series is a higher series of DB830plus+ with higher accuracy.
This is a 2-in-1 concept die bonder which achieved high levels of both stacked die packaging with DAF process and compatibility with general-purpose products of paste process.
Its easy switching between direct mode and parallel mode enables flexible production with the optimal process. -
High quality / High productivity
Use of intermediate stage ensures high quality and high productivity
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Multilayering support
- • Improved accuracy of bonding placement
- • Integrated vision system with position correction
- • Clean operation support reduces particle contamination during multilayering
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Thin die bonding technology
- • Multi-stage pickup enables thin die pickup operation
- • Wide variety of bonding sequences helps to reduce die stresses
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Series
DB850H
DB830plus+ Series
- DB830plus+ Series is a high accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process.
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High quality / High productivity
Use of intermediate stage ensures high quality and high productivity
-
Multilayering support
- • Improved accuracy of bonding placement
- • Integrated vision system with position correction
- • Clean operation support reduces particle contamination during multilayering
-
Thin die bonding technology
- • Multi-stage pickup enables thin die pickup operation
- • Wide variety of bonding sequences helps to reduce die stresses
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Series
DB830plus+D/DB830plus+/DB830plusH
/DB830plusS
DB820
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The brand new DB820 with its new high resolution vision system enables high productivity of small die by paste process.
DB820 based on DB830plus+ series can also support DAF process in demand for multi-die stacking. -
High quality / High productivity
- • Enhanced quality and stability inherited from the DB830plus+ series
- • Functional expansion for the paste products based on enhanced usability (Operator saving / Operator’s error reduction）
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Small Die handling
- • Stable small die handling (Min□0.3㎜)
- • Precise paste inspection with high resolution vision system
DD100 Series
DD100
DS100
- DD100 utilizes the characteristics of DB Series and it's equipped with a newly
developed dual pickup & bond head. Furthermore, it's also equipped with a newly developed dual lane, which
enables categorization of wafers. It's a high productivity die bonder that supports various different types of
production.
Furthermore, "DS100” as Single lane model is newly listed on lineup. -
High quality / High productivity
Newly developed dual pickup bond head & dual lane design in combination with an intermediate stage realizes high quality and high productivity
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Support for various production formats
- • Newly developed dual lane enables wafer category sorting and provides support for production of different types of products
- • Newly developed single lane model also enables wafer category sorting.
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Thin die bonding technology
- • Thin die pickup is made possible by multi-stage pushup method etc.
- • Versatile bonding sequence control reduces die stresses
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Series
DD100 / DD100F / DS100
DD100
DS100
FC300
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FC300 is newly launched in the market for FOPLP (Fan-Out Panel Level Package) of which die bonding is implemented on large size panel.
Flexible conversion between Face Up / Face Down process as well as multi die handling applications can support various types of products. -
High stable quality and productivity
- • Sophisticated Dual Gantry Drive enables high productivity with maintaining bond accuracy
- • High resolution vision system contributes to the improved recognition of die position
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Large Size Panel
- • Applicable to wide range up to 750x750mm (bond area 670x670mm)
- • Panel alignment function on bonding stage area
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Variable products
- • Multi-chip handling by recipe & tool changeover
- • EFEM connectivity applicable for panel L/UL
