공지사항

2026.06.02

제품지원

Notice of Support Termination for DB800/DB830 series　Running on Windows XP

2026.06.02

제품지원

Notice of Support Termination for Die Bonder Running on Windows 7

2026.03.18

공지사항

FUJI Group’s Fasford Technology to Unveil Next-Generation Die Bonder “XERDIA” at SEMICON CHINA 2026 for the First Time in the World

2025.08.07

공지사항

◆◆Exhibiting at SEMICON INDIA 2025 ◆◆

2025.04.03

공지사항

디스코 중공정 리서치 센터에 DB850H 설치

2025.03.18

전시회정보

SEMICON China 2025