공지사항

2026.06.15

제품지원

Notice of End of Support for Flexible Die Bonder DB830

2026.06.10

제품지원

Notice of End of Support for Flexible Die Bonder DB800HS/HSD【Updated】

2026.06.02

제품지원

Notice of Support Termination for DB800/DB830 series　Running on Windows XP

2026.06.02

제품지원

Notice of Support Termination for Die Bonder Running on Windows 7

2026.04.28

전시회정보

◆◆Exhibiting at SEMICON SEA 2026◆◆

2026.03.18

전시회정보

＞＞Exhibiting at SEMICON China 2026＞＞

2026.03.18

공지사항

FUJI Group’s Fasford Technology to Unveil Next-Generation Die Bonder “XERDIA” at SEMICON CHINA 2026 for the First Time in the World

2026.02.05

전시회정보

◆◆Exhibiting at SEMICON Korea 2026◆◆

2025.10.24

전시회정보

◆◆productronica 2025◆◆

2025.08.07

공지사항

◆◆Exhibiting at SEMICON INDIA 2025 ◆◆