通知

2026.06.15

通知

Notice of End of Support for Flexible Die Bonder DB830

2026.06.10

通知

Notice of End of Support for Flexible Die Bonder DB800HS/HSD【Updated】

2026.06.02

通知

Notice of Support Termination for DB800/DB830 series　Running on Windows XP

2026.06.02

通知

Notice of Support Termination for Die Bonder Running on Windows 7

2026.04.28

展会信息

◆◆Exhibiting at SEMICON SEA 2026◆◆

2026.03.18

展会信息

＞＞Exhibiting at SEMICON China 2026＞＞

2026.03.18

通知

FUJI集团旗下Fasford Technology将在SEMICON China 2026全球首次公开新世代固晶机「XERDIA」

2026.02.05

展会信息

◆◆Exhibiting at SEMICON Korea 2026◆◆

2025.10.24

展会信息

◆◆productronica 2025◆◆

2025.08.07

展会信息

◆◆Exhibiting at SEMICON INDIA 2025 ◆◆