Product Information
Die bonder products from Fasford Technology come in two series: the SiP* Bonder DB Series for fabricating flash memory as used for example in computers, smartphones, digital cameras, and portable music players, and the SiP Mounter CM Series for fabricating high-speed DRAM for computers.
SiP Bonder DB Series
-
DB830plus+
-
DD100
SiP Mounter CM Series
-
CM700X
Details
* The acronym SiP stands for “System in Package”