Product Information

Die bonder products from Fasford Technology come in two series: the SiP* Bonder DB Series for fabricating flash memory as used for example in computers, smartphones, digital cameras, and portable music players, and the SiP Mounter CM Series for fabricating high-speed DRAM for computers.



SiP Bonder DB Series



SiP Mounter CM Series


Details
* The acronym SiP stands for “System in Package”