{"id":13,"date":"2019-09-18T22:24:42","date_gmt":"2019-09-18T13:24:42","guid":{"rendered":"https:\/\/www.fasford-tech.com\/en\/?page_id=13"},"modified":"2025-01-31T12:31:06","modified_gmt":"2025-01-31T03:31:06","slug":"information","status":"publish","type":"page","link":"https:\/\/www.fasford-tech.com\/en\/products\/information\/","title":{"rendered":"Product information"},"content":{"rendered":"\r\n<ul class=\"p-product__menu\" id=\"product-menu\">\r\n  <li class=\"p-product__menuitem\">\r\n    <a href=\"#product1\">\r\n      <div class=\"p-product__menupic pic1\"><\/div>\r\n      <p class=\"p-product__menuname\"><span>DB850 Series<\/span><\/p>\r\n    <\/a>\r\n  <\/li>\r\n  <li class=\"p-product__menuitem\">\r\n    <a href=\"#product2\">\r\n      <div class=\"p-product__menupic pic2\"><\/div>\r\n      <p class=\"p-product__menuname\"><span>DB830plus+ Series<\/span><\/p>\r\n    <\/a>\r\n  <\/li>\r\n  <li class=\"p-product__menuitem\">\r\n    <a href=\"#product3\">\r\n      <div class=\"p-product__menupic pic3\"><\/div>\r\n      <p class=\"p-product__menuname\"><span>DB820<\/span><\/p>\r\n    <\/a>\r\n  <\/li>\r\n  <li class=\"p-product__menuitem\">\r\n    <a href=\"#product4\">\r\n      <div class=\"p-product__menupic pic4\"><\/div>\r\n      <p class=\"p-product__menuname\"><span>DD100 Series<\/span><\/p>\r\n    <\/a>\r\n  <\/li>\r\n  <li class=\"p-product__menuitem new\">\r\n    <a href=\"#product5\">\r\n      <div class=\"p-product__menupic pic5\"><\/div>\r\n      <p class=\"p-product__menuname\"><span>FC300<\/span><\/p>\r\n    <\/a>\r\n  <\/li>\r\n<\/ul>\r\n\r\n<!-- product item -->\r\n<h2 class=\"p-contents-heading--red p-contents-heading-l--red\" id=\"product1\">DB850 Series<\/h2>\r\n<div class=\"c-col2 p-box\">\r\n  <div class=\"p-product__image sp\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item00.png\" alt=\"DB850 Series\">\r\n  <\/div>\r\n  <div class=\"p-product__text\">\r\n    <dl class=\"p-product__list c-listline\">\r\n      <dd class=\"p-product--lead\">\r\n        DB850 Series is a higher series of DB830plus+ with higher accuracy.\r\n        This is a 2-in-1 concept die bonder which achieved high levels of both stacked die packaging with DAF process and compatibility with general-purpose products of paste process.\r\n        <br>Its easy switching between direct mode and parallel mode enables flexible production with the optimal process.\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">High quality \/ High productivity<\/p>\r\n        <p class=\"u-mb20\">Use of intermediate stage ensures high quality and high productivity<\/p>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Multilayering support<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Improved accuracy of bonding placement<\/li>\r\n          <li>\u2022 Integrated vision system with position correction<\/li>\r\n          <li>\u2022 Clean operation support reduces particle contamination during multilayering<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Thin die bonding technology<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Multi-stage pickup enables thin die pickup operation<\/li>\r\n          <li>\u2022 Wide variety of bonding sequences helps to reduce die stresses<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--gray u-mb10\">Series<\/p>\r\n        <p>DB850H<\/p>\r\n      <\/dd>\r\n    <\/dl>\r\n  <\/div>\r\n  <div class=\"p-product__image pc\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item00.png\" alt=\"DB850 Series\">\r\n  <\/div>\r\n  <div class=\"page-top\"><a href=\"#product-menu\">PAGE TOP<\/a><\/div>\r\n<\/div>\r\n<!-- \/\/product item -->\r\n\r\n<!-- product item -->\r\n<h2 class=\"p-contents-heading--red p-contents-heading-l--red\" id=\"product2\">DB830plus+ Series<\/h2>\r\n<div class=\"c-col2 p-box\">\r\n  <div class=\"p-product__image sp\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item01.png\" alt=\"DB830plus+ Series\">\r\n  <\/div>\r\n  <div class=\"p-product__text\">\r\n    <dl class=\"p-product__list c-listline\">\r\n      <dd class=\"p-product--lead\">\r\n        DB830plus+ Series is a high accuracy die bonder with the 2-in-1 concept, which supports a\r\n        stacked die packaging with DAF process and general-purpose products of paste process.\r\n        It can be switched easily between direct mode and parallel mode, which enables flexible production that supports\r\n        the optimal process.\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">High quality \/ High productivity<\/p>\r\n        <p class=\"u-mb20\">Use of intermediate stage ensures high quality and high productivity<\/p>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Multilayering support<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Improved accuracy of bonding placement<\/li>\r\n          <li>\u2022 Integrated vision system with position correction<\/li>\r\n          <li>\u2022 Clean operation support reduces particle contamination during multilayering<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Thin die bonding technology<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Multi-stage pickup enables thin die pickup operation<\/li>\r\n          <li>\u2022 Wide variety of bonding sequences helps to reduce die stresses<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--gray u-mb10\">Series<\/p>\r\n        <p class=\"exception\">DB830plus+D\/DB830plus+\/DB830plusH<br>\/DB830plusS<\/p>\r\n      <\/dd>\r\n    <\/dl>\r\n  <\/div>\r\n  <div class=\"p-product__image pc\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item01.png\" alt=\"DB830plus+ Series\">\r\n  <\/div>\r\n  <div class=\"page-top\"><a href=\"#product-menu\">PAGE TOP<\/a><\/div>\r\n<\/div>\r\n<!-- \/\/product item -->\r\n\r\n<!-- product item -->\r\n<h2 class=\"p-contents-heading--red p-contents-heading-l--red\" id=\"product3\">DB820<\/h2>\r\n<div class=\"c-col2 p-box\">\r\n  <div class=\"p-product__image sp\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item05.png\" alt=\"DB820\">\r\n  <\/div>\r\n  <div class=\"p-product__text\">\r\n    <dl class=\"p-product__list c-listline\">\r\n      <dd class=\"p-product--lead\">\r\n        The brand new DB820 with its new high resolution vision system enables high productivity of small die by paste process.<br>DB820 based on DB830plus+ series can also support DAF process in demand for multi-die stacking.\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">High quality \/ High productivity<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Enhanced quality and stability inherited from the DB830plus+ series<\/li>\r\n          <li>\u2022 Functional expansion for the paste products based on enhanced usability (Operator saving \/ Operator\u2019s error reduction\uff09<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Small Die handling<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Stable small die handling (Min\u25a10.3\u339c)<\/li>\r\n          <li>\u2022 Precise paste inspection with high resolution vision system<\/li>\r\n        <\/ul>\r\n      <\/dd>      \r\n    <\/dl>\r\n  <\/div>\r\n  <div class=\"p-product__image pc\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item05.png\" alt=\"DB820\">\r\n  <\/div>\r\n  <div class=\"page-top\"><a href=\"#product-menu\">PAGE TOP<\/a><\/div>\r\n<\/div>\r\n<!-- \/\/product item -->\r\n\r\n<!-- product item -->\r\n<h2 class=\"p-contents-heading--red p-contents-heading-l--red\" id=\"product4\">DD100 Series<\/h2>\r\n<div class=\"c-col2 p-box\">\r\n  <div class=\"p-product__image sp\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item02.png\" alt=\"DD100 Series\">\r\n    <p class=\"p-product__image_text\">DD100<\/p>\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item04.png\" alt=\"DD100 Series DS100\">\r\n    <p class=\"p-product__image_text\">DS100<\/p>\r\n  <\/div>\r\n  <div class=\"p-product__text\">\r\n    <dl class=\"p-product__list c-listline\">\r\n      <!-- <dt class=\"p-product_name--red\">DD100<\/dt> -->\r\n      <dd class=\"p-product--lead\">DD100 utilizes the characteristics of DB Series and it's equipped with a newly\r\n        developed dual pickup &amp; bond head. Furthermore, it's also equipped with a newly developed dual lane, which\r\n        enables categorization of wafers. It's a high productivity die bonder that supports various different types of\r\n        production.<br>Furthermore, \"DS100\u201d as Single lane model is newly listed on lineup.<\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">High quality \/ High productivity<\/p>\r\n        <p class=\"u-mb20\">Newly developed dual pickup bond head &amp; dual lane design in combination with an\r\n          intermediate stage realizes high quality and high productivity<\/p>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Support for various production formats<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Newly developed dual lane enables wafer category sorting and provides support for production of\r\n            different types of products<\/li>\r\n          <li>\u2022 Newly developed single lane model also enables wafer category sorting.<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Thin die bonding technology<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Thin die pickup is made possible by multi-stage pushup method etc.\r\n          <\/li>\r\n          <li>\u2022 Versatile bonding sequence control reduces die stresses<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--gray u-mb10\">Series<\/p>\r\n        <p>DD100 \/ DD100F \/ DS100<\/p>\r\n      <\/dd>\r\n    <\/dl>\r\n  <\/div>\r\n  <div class=\"p-product__image pc\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item02.png\" alt=\"DD100 Series\">\r\n    <p class=\"p-product__image_text\">DD100<\/p>\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item04.png\" alt=\"DD100 Series DS100\">\r\n    <p class=\"p-product__image_text\">DS100<\/p>\r\n  <\/div>\r\n  <div class=\"page-top\"><a href=\"#product-menu\">PAGE TOP<\/a><\/div>\r\n<\/div>\r\n<!-- \/\/product item -->\r\n\r\n<!-- product item -->\r\n<h2 class=\"p-contents-heading--red p-contents-heading-l--red\" id=\"product5\">FC300<\/h2>\r\n<div class=\"c-col2 p-box\">\r\n  <div class=\"p-product__image sp\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item06.png\" alt=\"FC300\">\r\n  <\/div>\r\n  <div class=\"p-product__text\">\r\n    <dl class=\"p-product__list c-listline\">\r\n      <dd class=\"p-product--lead\">\r\n        FC300 is newly launched in the market for FOPLP (Fan-Out Panel Level Package) of which die bonding is implemented on large size panel. <br>Flexible conversion between Face Up \/ Face Down process as well as multi die handling applications can support various types of products. \r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">High stable quality and productivity<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Sophisticated Dual Gantry Drive enables high productivity with maintaining bond accuracy<\/li>\r\n          <li>\u2022 High resolution vision system contributes to the improved recognition of die position<\/li>\r\n        <\/ul>\r\n      <\/dd>      \r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Large Size Panel<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Applicable to wide range up to 750x750mm (bond area 670x670mm)<\/li>\r\n          <li>\u2022 Panel alignment function on bonding stage area<\/li>\r\n        <\/ul>\r\n      <\/dd>\r\n      <dd>\r\n        <p class=\"c-label--red u-mb10\">Variable products<\/p>\r\n        <ul class=\"u-mb20\">\r\n          <li>\u2022 Multi-chip handling by recipe &amp; tool changeover<\/li>\r\n          <li>\u2022 EFEM connectivity applicable for panel L\/UL<\/li>\r\n        <\/ul>\r\n      <\/dd>         \r\n    <\/dl>\r\n  <\/div>\r\n  <div class=\"p-product__image pc\">\r\n    <img decoding=\"async\" src=\"https:\/\/www.fasford-tech.com\/en\/wp-content\/themes\/fasford_child_en\/assets\/images\/img_product_item06.png\" alt=\"FC300\">\r\n  <\/div>\r\n  <div class=\"page-top\"><a href=\"#product-menu\">PAGE TOP<\/a><\/div>\r\n<\/div>\r\n<!-- \/\/product item -->\r\n\r\n\r\n\r\n","protected":false},"excerpt":{"rendered":"DB850 Series DB830plus+ Series DB820 DD100 Series FC300 DB850 Series DB850 Series is a higher series of DB830p [&hellip;]","protected":false},"author":1,"featured_media":0,"parent":7,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"templete-col1.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-13","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/pages\/13","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/comments?post=13"}],"version-history":[{"count":13,"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/pages\/13\/revisions"}],"predecessor-version":[{"id":385,"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/pages\/13\/revisions\/385"}],"up":[{"embeddable":true,"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/pages\/7"}],"wp:attachment":[{"href":"https:\/\/www.fasford-tech.com\/en\/wp-json\/wp\/v2\/media?parent=13"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}