We support in
"creating the future"
Digital products make our life more convenient and improve the way we live. A semiconductor is a part in those products that works an important role. Fasford Technology supports the future of both Japan and the world through manufacture of semiconductor manufacturing equipment "Die Bonder".
We hold a high market share in the global industry of die bonder equipment.
The first is NAND, which is used for SD cards, smartphones and SSD.
The second is "DB/DD series", which is used in the manufacturing process of Flash memory.
The last but not least is "CM series", which is used in the manufacturing process of DRAM used for computers and data centers.
Fasford Technology's business vision is to "Lead the world with our bonding technology". Here, we'd like to talk about our globally recognized advanced technology.
We're going to explain about die bonder, of which Fasford Technology proudly holds a high market share in the global industry, and also talk about what we do.
Challenge the world.
The world is our field.
We're looking for those who can work with us in the global market in order
to cater to our clients' needs and contribute to their businesses.