Support the Innovation

scroll

SCROLL

We support in
"creating the future"

Digital products make our life more convenient and improve the way we live. A semiconductor is a part in those products that works an important role. Fasford Technology supports the future of both Japan and the world through manufacture of semiconductor manufacturing equipment "Die Bonder".

Corporate Philosophy

We hold a high market share in the global industry of die bonder equipment.

Fasford Technology manufactures three types of die bonder equipment.
The first is NAND, which is used for SD cards, smartphones and SSD.
The second is "DB/DD series", which is used in the manufacturing process of Flash memory.
The last but not least is "CM series", which is used in the manufacturing process of DRAM used for computers and data centers.

Product Information

TECHNOLOGY

Fasford Technology's business vision is to "Lead the world with our bonding technology". Here, we'd like to talk about our globally recognized advanced technology.

COMING SOON

WORKS

We're going to explain about die bonder, of which Fasford Technology proudly holds a high market share in the global industry, and also talk about what we do.

MORE

NEWS&TOPICS

RECRUIT

Challenge the world.

The world is our field.
We're looking for those who can work with us in the global market in order
to cater to our clients' needs and contribute to their businesses.

RECRUIT(Japanese)