Fasford Technology at SEMICON Taiwan 2019

We will attend SEMICON Taiwan 2019 during 18/Sep. – 20/Sep. and exhibit our latest Sip Bonder DB850H. We are looking forward to welcoming you at the show and please feel free to let us know when you want to see M/C operation.
Location:Taipei World Trade Center Nangang Exhibition Hall(TWTC Nangang)
Booth:Exhibited at JIPAL Booth as our valued partner M348(4th Floor)