During SEMICON Japan 2018 in December last year, many people visited our booth, and thank you very much for your visit.
This is to inform that we will attend NEPCON Japan / semiconductor packaging technology exhibition this year also to be held at Tokyo Big Sight from January 16 (Wed) to 18 (Fri) and demonstrate the SiP bonder DB830plusS at the show.
This model (DB830plusS) evolved the technology of hybrid applications for thin die pickup, high precision die stacking, and small die handling with high UPH.
We are looking forward to your coming to take a look at our tool and technologies.
Place ： Tokyo Big Sight
Hall : East 3