We are pleased to announce you that we will participate in Semicon Japan 2018 during 12-14/Dec. to exhibit SiP Bonder DB830plusS for the demonstration.
This die bonder capable of 300 wafer handling, high speed, high accuracy, stressless pickup is perfectly suitable for thinner die stacking, and paste process.
In addition to the above exhibition booth, we also have a booth at the “Future College” that introduces semiconductor manufacturing technology to students arranged by SEMI in an easy-to-understand manner.
We are looking forward to seeing you by all means when you come to the hall.
Place ： Tokyo Big Sight
Booth ： Hall 1・No.1509