Fasford Technology at SEMICON Taiwan 2018

We will attend SEMICON Taiwan 2018 during 5/Sep. – 7/Sep. and exhibit our latest Sip Bonder DB830plusS. We are looking forward to welcoming you at the show and please feel free to let us know when you want to see M/C operation.

Location : Taipei World Trade Center Nangang Exhibition Hall (TWTC Nangang)
Booth : Exhibited at JIPAL Booth as our valued partner(L116)