We will attend SEMICON CHINA 2018 during 14/Mar. – 16/Mar. and exhibit our latest Die Bonder DB830plusS.
This die bonder is not only applied for thinner die multi-stacking with film process, but contributed to the higher productivity of paste process.
We are looking forward to welcoming you at the show and please feel free to let us know when you want to see M/C operation.
Location : Shanghai New International Exhibition Center (SNIEC)
Booth : Exhibited at JIPAL Booth as our valued partner