During SEMICON Japan 2017 in December last year, many people visited our booth, and thank you very much for your visit.
This is to inform that we will attend NEPCON Japan / semiconductor packaging technology exhibition this year also to be held at Tokyo Big Sight from January 17 (Wed) to 19 (Fri) and demonstrate the SiP bonder DB830plusH at the show.
This model (DB830plusH) evolved the technology of thin die pickup and high precision die stacking.
We are looking forward to your coming to take a look at our our tool and technologies.
Place ： Tokyo Big Sight
Hall : East 3