SiP Mounter CM Series



SiP Mounter CM SeriesThe CM700X supports assembly of advanced packages such as required for high-speed DRAM.
A lamination function and integrated bulk recognition capability result in high performance and high accuracy positioning technology enables the realization of narrow pad pitch support.


  • Compatible with 300 mm and 200 mm wafers
  • Supports assembly of μBGA®* and BOC DRAM packages
  • Flexible mounting mode selection allows optimal matching to various packages
* µBGA® is a registered trademark of Tessera, Inc.

Product lineup

  • CM700R
  • CM700X
  • CM700MX