The DB830plus+ is a high-speed, high-performance die bonder optimized for SiP assembly. It supports 300 mm wafers and represents another leap forward in the DB-800 series.
Thanks to the use of an intermediate stage and support for clean operation that reduces particle contamination during multilayering, the product is ideal for thin die and multi-stage bonding applications.
FeaturesHigh quality / High productivity
Use of intermediate stage ensures high quality and high productivity
- Integrated vision system with position correction
- Clean operation support reduces particle contamination during multilayering
- Multi-stage pickup enables thin die pickup operation
- Wide variety of bonding sequences helps to reduce die stresses