Die Bonder Business

World-renowned die bonder equipment

The die bonder business involves the manufacture of equipment used in the back-end process of semiconductor fabrication.

Semiconductor fabrication is divided into the so-called front-end process which comprises the steps from circuit design to forming the actual circuits on the wafer, and the back-end process which comprises the steps from wafer dicing to die assembly and final inspection of the completed product.

Fasford Technology is engaged in the development, design, manufacture, marketing and servicing of die bonders which handle a critical step in the back-end process. Our development power, technological expertise, and capacity for meeting customer needs have found high acclaim among semiconductor manufacturers worldwide, and we are recognized as a top-class back-end manufacturing contractor with a leading market share.

The semiconductor manufacturing process

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